LM3152-3.3 Demonstration Board Fabrication Notes

Unless otherwise specified
1. Material: FR4
	Finished Board: 0.063 inches
2. All conductor layers must be registered within +/- 0.005 inches from true position.
3. Etch tolerances:
	All external layers conductor width must be within +/- 0.0015 inches or +/- 15% of gerber data, whichever is
	smaller.
4. Board must be NC drilled using drill data supplied.
5. Drill tolerances and hole sizes are for finished board:
	All plated through holes to 0.80 inches are +/- 0.003 inches.
	All plated through holes over 0.081 inches are +/- 0.005 inches.
6. All holes must be registered within +/-0.003 inches from true position.
7. Minimum annular ring must be 0.002 inches.
8. Plating:
	8A. Plated through holes must be plated with 1oz copper.
	8B. Finish: Immersion gold: 2oz copper.
9. Warp and twist of finished boards must not exceed 0.007 inch per inch.
10. Soldermask: Per IPC-SM-840
	10A. Soldermask both top and bottom sides.
	10B. Soldermask must clear all lands shown on gerber soldermask layers.
11. Silkscreen top side and bottom side using glossy white, nonconductive, epoxy based ink.
	No silkscreen allowed on gold areas, on pads, or in holes.
12. Other vendor nomenclature or markings should not be etched on board without prior permission.
13. All vendor in-process markings, QA stamps, etc. must be placed on the bottom side of board.
14. Finished board must meet UL94V-0 rating and RoHS compliance.